Audio Series

Product Features

Integrates Wi-Fi and Low-Power Bluetooth (BLE 5.0/5.2/5.3), features rich peripheral interfaces, achieves system-level protection through a hardware-based security architecture, and delivers the lowest power consumption performance. Includes an Audio Codec module to support voice signal acquisition and playback.

Highlights

Three-core Architecture

  • Tensilica® HiFi 5 DSP @500MHz

    • 8 x 32-bit MAC/cycle

    • 8 x SP-FMAC/cycle

    • 32 x 8-bit MAC/cycle(NN)

    • 256KB dedicated DTCM

  • Real-M300 @400MHz

    • Armv8.1-M architecture (Arm® Cortex®-M55 ISA compatible)

    • Dedicated application processor

    • FPU/DSP extension instructions

  • RISC-V KR4 @400MHz

    • Dedicated network processor

  • KR4 and Real-M300 can swap roles

Storage and Security

  • Storage

    • 512KB SRAM

    • QSPI NOR Flash

    • DQ8 DDR PSRAM

  • Security

    • PSA Level 1 Certified 👉

    • TrustZone®-M

    • TRNG/ECDSA

    • AES/SHA

    • JTAG/SWD password protection

Wireless

  • Wi-Fi6 2.4G

  • Wi-Fi Card Mode 👉

  • BLE 5.2

  • BLE Mesh 1.1 long Range

  • LE Audio

  • BT Classic

Low Power

  • Sleep Mode:

    • WoWLAN DTIM=10: 1.36mA

    • Wi-Fi OFF: 0.7mA

  • Deep-Sleep: 57.4µA

More

  • Audio

    • DMIC/PDM/I2S

Resources

Product Comparison

Package number

Real-M300

KR4

DSP

On-chip SRAM

TrustZone

Flash

PSRAM

Wi-Fi

Bluetooth

Operating temperature

Package (mm)

RTL8726EAM-VA4-CG

400MHz

400MHz

500MHz

512KB

Y

X

16MB

Wi-Fi 6 (2.4GHz)

Bluetooth 5.2

-20°C ~ 85°C

QFN68 (8 x 8)

Block Diagram

../rst_product/figures/block_diagram_lite.svg

Core Architecture

  • Real-M300 (KM4)

    • Armv8.1-M architecture (Arm® Cortex®-M55 ISA compatible)

    • Up to 400MHz, 3-stage pipeline

    • 16KB 4-way I-Cache + 16KB 4-way D-Cache

    • Integrated FPU/DSP extensions, and M-profile Vector Extension (MVE)

    • Hardware-enforced isolation via Arm® TrustZone®-M

  • KR4

    • RISC-V RV32IMAFC architecture

    • 400MHz single-issue in-order pipeline

    • 16KB 4-way I-Cache + 16KB 4-way D-Cache

    • Open-source ISA with custom extension support

  • Cadence® Tensilica® HiFi 5 DSP

    • 500MHz 5-slot VLIW architecture

    • 8 x 32-bit MAC/cycle, Optional SP-FPU (8 SP-FMAC/cycle)

    • Neural Network Extension (32 x 8-bit MAC/cycle)

    • 32KB 4-way I-Cache, 48KB 3-way D-Cache

    • 256KB dedicated DTCM memory

Memory System

  • On-chip memory: 512KB SRAM

  • External memory (including KGD):

    • QSPI NOR Flash (up to 104MHz)

    • DQ8 DDR PSRAM (up to 250MHz)

  • Bus architecture: Multi-layer AXI bus with parallel access

Peripheral Interfaces

  • Matrix-type pin configuration, each pin supports almost all functions

  • Multiple communication interfaces: SPI x 2, UART x 5, I2C x 2

  • Hardware IR transceiver, easy to adapt to various IR protocols

  • Supports RTC timer and 15 independent timers

  • Supports 8-channel PWM timer and 1 capture timer

  • Supports 6-channel general-purpose 12-bit ADC

  • Supports 9-channel touch key

  • Supports 8 independent channel GDMA

  • Supports 1 independent watchdog, 2 secure area watchdogs, and 3 general watchdogs

  • Embeds a serial LEDC to control the external LED lamps

  • Supports thermal detector to detect and monitor the real-time temperature inside the chip

  • Audio system:

    • 3-channel ADC or 4-channel digital microphone (DMIC) input

    • 1-channel digital-to-analog converter (DAC)

    • Integrates 2 I2S interfaces (up to 384kHz sampling rate, supports up to 8-channel data transmission and reception)

Security

  • Secure boot

  • Arm TrustZone-M security architecture

  • True Random Number Generator (TRNG)

  • Hardware encryption engine (AES/SHA/ECDSA)

  • Flash full-disk/partition encryption

  • Read Protection (RDP) mechanism

  • JTAG/SWD port password protection/disabling

  • 2KB OTP memory (2K bits available for user)

Wireless Connectivity

  • Wi-Fi 6 (2.4GHz 802.11ax)

    • Supports 802.11b/g/n/ax protocols with 20MHz bandwidth

    • PHY rates:286.8Mbps (HT40), 114.7Mbps (HE20)

    • Antenna diversity

  • Bluetooth 5.2 LE

    • LE Coded PHY long-range mode (125kbps/500kbps)

    • AoA/AoD positioning (±15° accuracy)

    • Scatternet concurrent master/slave operation

    • SIG Mesh v1.0 and v1.1.1

RF Performance

  • Wi-Fi Tx power:

    • 11b 11Mbps: 20dBm

    • 11g 54Mbps: 19dBm (EVM < −25dB)

    • 11n MCS7-HT20: 18dBm (EVM < −27dB)

    • 11ax MCS9-HE20: 16dBm (EVM < −32dB)

  • Wi-Fi Rx sensitivity:

    • 11b 11Mbps: −91dBm

    • 11g 54Mbps: −78dBm

    • 11n MCS7-HT20: −76.5dBm

    • 11ax MCS9-HE20: −70.5dBm

  • BLE specifications:

    • Tx power: +10dBm (0.5dB step)

    • Rx sensitivity: -97dBm@1Mbps

Power Management

  • Dynamic voltage scaling (0.8V ~ 1.2V)

  • Power modes:

    • Active mode (Wi-Fi Tx): 120mA@3.3V

    • Sleep mode: Peripherals and Wi-Fi can wake up the system

    • Deep-Sleep mode: 57.4μA (RTC retention)

Package and Reliability

  • QFN48 package: 6mm x 6mm

  • QFN68 package: 8mm x 8mm

  • Operating voltage:

    • Standard voltage: 2.97V ~ 3.63V

  • Operating temperature:

    • Standard temperature: -20°C ~ 85°C

    • Wide-range temperature: -40°C ~ 105°C

  • ESD protection: HBM ±3.5kV

Application Scenarios

  • Home appliance

  • Line controller

  • BLE gateway

  • Micro inverter

  • Portable energy storage

  • Home energy storage