HiFi DSP Series

Product Features

Integrates Wi-Fi and Low-Power Bluetooth (BLE 5.0/5.2/5.3), features rich peripheral interfaces, achieves system-level protection through a hardware-based security architecture, and delivers optimal power consumption performance. The SoC integrates HiFi5 DSP, precisely empowering intelligent perception layers (AI inference/image processing) and human-machine interaction layers (voice recognition/HMI).

RTL8726ERTL8713E

Highlights

Three-core Architecture

• Tensilica® HiFi 5 DSP @500MHz

  • 8 x 32-bit MAC/cycle

  • 8 x SP-FMAC/cycle

  • 32 x 8-bit MAC/cycle(NN)

  • 256KB dedicated DTCM

• Real-M300 @400MHz

  • Armv8.1-M architecture (Arm® Cortex®-M55 ISA compatible)

  • Dedicated application processor

  • FPU/DSP extension instructions

• RISC-V KR4 @400MHz

  • Dedicated network processor

• KR4 and Real-M300 can swap roles

Storage and Security

• Storage

  • 512KB SRAM

  • QSPI NOR Flash

  • DQ8 DDR PSRAM

• Security

  • PSA Level 1 Certified 👉

  • TrustZone®-M

  • TRNG/ECDSA

  • AES/SHA

  • JTAG/SWD password protection

Wireless

• Wi-Fi6 2.4G

• Wi-Fi Card Mode 👉

• BLE 5.2

• BLE Mesh 1.1 long Range

• LE Audio

• BT Classic

Low Power

• Sleep Mode:

  • WoWLAN DTIM=10: 1.36mA

  • Wi-Fi OFF: 0.7mA

• Deep-Sleep: 57.4µA

More

• Audio

  • DMIC/PDM/I2S

Resources

• Datasheet

• Hardware Design Guide

• PCB Design Guide

• HDK

• EVB User Guide

• Pinmux

• Tools

• HiFi DSP

Product Comparison

Package number	Real-M300	KR4	DSP	On-chip SRAM	TrustZone	Flash	PSRAM	Wi-Fi	Bluetooth	Operating temperature	Package (mm)
RTL8726EAM-VA4-CG	400MHz	400MHz	500MHz	512KB	Y	X	16MB	Wi-Fi 6 (2.4GHz)	Bluetooth 5.2	-20°C ~ 85°C	QFN68 (8 x 8)

Block Diagram

Core Architecture

• Real-M300 (KM4)

  • Armv8.1-M architecture (Arm® Cortex®-M55 ISA compatible)

  • Up to 400MHz, 3-stage pipeline

  • 16KB 4-way I-Cache + 16KB 4-way D-Cache

  • Integrated FPU/DSP extensions, and M-profile Vector Extension (MVE)

  • Hardware-enforced isolation via Arm® TrustZone®-M

• KR4

  • RISC-V RV32IMAFC architecture

  • 400MHz single-issue in-order pipeline

  • 16KB 4-way I-Cache + 16KB 4-way D-Cache

  • Open-source ISA with custom extension support

• Cadence® Tensilica® HiFi 5 DSP

  • 500MHz 5-slot VLIW architecture

  • 8 x 32-bit MAC/cycle, Optional SP-FPU (8 SP-FMAC/cycle)

  • Neural Network Extension (32 x 8-bit MAC/cycle)

  • 32KB 4-way I-Cache, 48KB 3-way D-Cache

  • 256KB dedicated DTCM memory

Memory System

• On-chip memory: 512KB SRAM

• External memory (including KGD):

  • QSPI NOR Flash (up to 104MHz)

  • DQ8 DDR PSRAM (up to 250MHz)

• Bus architecture: Multi-layer AXI bus with parallel access

Peripheral Interfaces

• Matrix-type pin configuration, each pin supports almost all functions

• Multiple communication interfaces: SPI x 2, UART x 5, I2C x 2

• Hardware IR transceiver, easy to adapt to various IR protocols

• Supports RTC timer and 15 independent timers

• Supports 8-channel PWM timer and 1 capture timer

• Supports 6-channel general-purpose 12-bit ADC

• Supports 9-channel touch key

• Supports 8 independent channel GDMA

• Supports 1 independent watchdog, 2 secure area watchdogs, and 3 general watchdogs

• Embeds a serial LEDC to control the external LED lamps

• Supports thermal detector to detect and monitor the real-time temperature inside the chip

• Audio system:

  • 3-channel ADC or 4-channel digital microphone (DMIC) input

  • 1-channel digital-to-analog converter (DAC)

  • Integrates 2 I2S interfaces (up to 384kHz sampling rate, supports up to 8-channel data transmission and reception)

Security

• Secure boot

• Arm TrustZone-M security architecture

• True Random Number Generator (TRNG)

• Hardware encryption engine (AES/SHA/ECDSA)

• Flash full-disk/partition encryption

• Read Protection (RDP) mechanism

• JTAG/SWD port password protection/disabling

• 2KB OTP memory (2K bits available for user)

Wireless Connectivity

• Wi-Fi 6 (2.4GHz 802.11ax)

  • Supports 802.11b/g/n/ax protocols with 20MHz bandwidth

  • PHY rates:286.8Mbps (HT40), 114.7Mbps (HE20)

  • Antenna diversity

• Bluetooth 5.2 LE

  • LE Coded PHY long-range mode (125kbps/500kbps)

  • AoA/AoD positioning (±15° accuracy)

  • Scatternet concurrent master/slave operation

  • SIG Mesh v1.0 and v1.1.1

RF Performance

• Wi-Fi Tx power:

  • 11b 11Mbps: 20dBm

  • 11g 54Mbps: 19dBm (EVM < −25dB)

  • 11n MCS7-HT20: 18dBm (EVM < −27dB)

  • 11ax MCS9-HE20: 16dBm (EVM < −32dB)

• Wi-Fi Rx sensitivity:

  • 11b 11Mbps: −91dBm

  • 11g 54Mbps: −78dBm

  • 11n MCS7-HT20: −76.5dBm

  • 11ax MCS9-HE20: −70.5dBm

• BLE specifications:

  • Tx power: +10dBm (0.5dB step)

  • Rx sensitivity: -97dBm@1Mbps

Power Management

• Dynamic voltage scaling (0.8V ~ 1.2V)

• Power modes:

  • Active mode (Wi-Fi Tx): 120mA@3.3V

  • Sleep mode: Peripherals and Wi-Fi can wake up the system

  • Deep-Sleep mode: 57.4μA (RTC retention)

Package and Reliability

• QFN48 package: 6mm x 6mm

• QFN68 package: 8mm x 8mm

• Operating voltage:

  • Standard voltage: 2.97V ~ 3.63V

• Operating temperature:

  • Standard temperature: -20°C ~ 85°C

  • Wide-range temperature: -40°C ~ 105°C

• ESD protection: HBM ±3.5kV

Application Scenarios

• Home appliance

• Line controller

• BLE gateway

• Micro inverter

• Portable energy storage

• Home energy storage