Wi-Fi 6 Series
Product Features
Integrates Wi-Fi 6 (compliant with IEEE 802.11ax standard) and Low-Power Bluetooth (BLE 5.0/5.2/5.3), features rich peripheral interfaces, achieves system-level protection through a hardware-based security architecture, and delivers optimal power consumption performance. Wi-Fi 6 integration ensures higher throughput and lower latency for users.
Highlights
Three-core Architecture
Tensilica® HiFi 5 DSP @500MHz
8 x 32-bit MAC/cycle
8 x SP-FMAC/cycle
32 x 8-bit MAC/cycle(NN)
256KB dedicated DTCM
Real-M300 @400MHz
Armv8.1-M architecture (Arm® Cortex®-M55 ISA compatible)
Dedicated application processor
FPU/DSP extension instructions
RISC-V KR4 @400MHz
Dedicated network processor
KR4 and Real-M300 can swap roles
Storage and Security
Storage
512KB SRAM
QSPI NOR Flash
DQ8 DDR PSRAM
Security
PSA Level 1 Certified 👉
TrustZone®-M
TRNG/ECDSA
AES/SHA
JTAG/SWD password protection
Wireless
Wi-Fi6 2.4G
Wi-Fi Card Mode 👉
BLE 5.2
BLE Mesh 1.1 long Range
LE Audio
BT Classic
Low Power
Sleep Mode:
WoWLAN DTIM=10: 1.36mA
Wi-Fi OFF: 0.7mA
Deep-Sleep: 57.4µA
More
Audio
DMIC/PDM/I2S
Product Comparison
Package number |
Real-M300 |
KR4 |
DSP |
On-chip SRAM |
TrustZone |
Flash |
PSRAM |
Wi-Fi |
Bluetooth |
Operating temperature |
Package (mm) |
---|---|---|---|---|---|---|---|---|---|---|---|
RTL8726EAM-VA4-CG |
400MHz |
400MHz |
500MHz |
512KB |
Y |
X |
16MB |
Wi-Fi 6 (2.4GHz) |
Bluetooth 5.2 |
-20°C ~ 85°C |
QFN68 (8 x 8) |
Block Diagram
Core Architecture
Real-M300 (KM4)
Armv8.1-M architecture (Arm® Cortex®-M55 ISA compatible)
Up to 400MHz, 3-stage pipeline
16KB 4-way I-Cache + 16KB 4-way D-Cache
Integrated FPU/DSP extensions, and M-profile Vector Extension (MVE)
Hardware-enforced isolation via Arm® TrustZone®-M
KR4
RISC-V RV32IMAFC architecture
400MHz single-issue in-order pipeline
16KB 4-way I-Cache + 16KB 4-way D-Cache
Open-source ISA with custom extension support
Cadence® Tensilica® HiFi 5 DSP
500MHz 5-slot VLIW architecture
8 x 32-bit MAC/cycle, Optional SP-FPU (8 SP-FMAC/cycle)
Neural Network Extension (32 x 8-bit MAC/cycle)
32KB 4-way I-Cache, 48KB 3-way D-Cache
256KB dedicated DTCM memory
Memory System
On-chip memory: 512KB SRAM
External memory (including KGD):
QSPI NOR Flash (up to 104MHz)
DQ8 DDR PSRAM (up to 250MHz)
Bus architecture: Multi-layer AXI bus with parallel access
Peripheral Interfaces
Matrix-type pin configuration, each pin supports almost all functions
Multiple communication interfaces: SPI x 2, UART x 5, I2C x 2
Hardware IR transceiver, easy to adapt to various IR protocols
Supports RTC timer and 15 independent timers
Supports 8-channel PWM timer and 1 capture timer
Supports 6-channel general-purpose 12-bit ADC
Supports 9-channel touch key
Supports 8 independent channel GDMA
Supports 1 independent watchdog, 2 secure area watchdogs, and 3 general watchdogs
Embeds a serial LEDC to control the external LED lamps
Supports thermal detector to detect and monitor the real-time temperature inside the chip
Audio system:
3-channel ADC or 4-channel digital microphone (DMIC) input
1-channel digital-to-analog converter (DAC)
Integrates 2 I2S interfaces (up to 384kHz sampling rate, supports up to 8-channel data transmission and reception)
Security
Secure boot
Arm TrustZone-M security architecture
True Random Number Generator (TRNG)
Hardware encryption engine (AES/SHA/ECDSA)
Flash full-disk/partition encryption
Read Protection (RDP) mechanism
JTAG/SWD port password protection/disabling
2KB OTP memory (2K bits available for user)
Wireless Connectivity
Wi-Fi 6 (2.4GHz 802.11ax)
Supports 802.11b/g/n/ax protocols with 20MHz bandwidth
PHY rates:286.8Mbps (HT40), 114.7Mbps (HE20)
Antenna diversity
Bluetooth 5.2 LE
LE Coded PHY long-range mode (125kbps/500kbps)
AoA/AoD positioning (±15° accuracy)
Scatternet concurrent master/slave operation
SIG Mesh v1.0 and v1.1.1
RF Performance
Wi-Fi Tx power:
11b 11Mbps: 20dBm
11g 54Mbps: 19dBm (EVM < −25dB)
11n MCS7-HT20: 18dBm (EVM < −27dB)
11ax MCS9-HE20: 16dBm (EVM < −32dB)
Wi-Fi Rx sensitivity:
11b 11Mbps: −91dBm
11g 54Mbps: −78dBm
11n MCS7-HT20: −76.5dBm
11ax MCS9-HE20: −70.5dBm
BLE specifications:
Tx power: +10dBm (0.5dB step)
Rx sensitivity: -97dBm@1Mbps
Power Management
Dynamic voltage scaling (0.8V ~ 1.2V)
Power modes:
Active mode (Wi-Fi Tx): 120mA@3.3V
Sleep mode: Peripherals and Wi-Fi can wake up the system
Deep-Sleep mode: 57.4μA (RTC retention)
Package and Reliability
QFN48 package: 6mm x 6mm
QFN68 package: 8mm x 8mm
Operating voltage:
Standard voltage: 2.97V ~ 3.63V
Operating temperature:
Standard temperature: -20°C ~ 85°C
Wide-range temperature: -40°C ~ 105°C
ESD protection: HBM ±3.5kV
Application Scenarios
Home appliance
Line controller
BLE gateway
Micro inverter
Portable energy storage
Home energy storage
Highlights
Three-core Architecture
Tensilica® HiFi 5 DSP @500MHz
8 x 32-bit MAC/cycle
8 x SP-FMAC/cycle
32 x 8-bit MAC/cycle(NN)
256KB dedicated DTCM
Real-M300 @400MHz
Armv8.1-M architecture (Arm® Cortex®-M55 ISA compatible)
Dedicated application processor
FPU/DSP extension instructions
RISC-V KR4 @400MHz
Dedicated network processor
KR4 and Real-M300 can swap roles
Storage and Security
Storage
512KB SRAM
QSPI NOR Flash
DQ8 DDR PSRAM
Security
PSA Level 1 Certified 👉
TRNG/ECDSA
AES/SHA
JTAG/SWD password protection
Wireless
Wi-Fi6 2.4G
Wi-Fi Card Mode 👉
BLE 5.2
BLE Mesh 1.1 long Range
BT Classic
Low Power
Sleep Mode:
WoWLAN DTIM=10: 1.36mA
Wi-Fi OFF: 0.7mA
Deep-Sleep: 57.4µA
More
Audio
DMIC/PDM/I2S
Product Comparison
Package number |
Real-M300 |
KR4 |
DSP |
On-chip SRAM |
TrustZone |
Flash |
PSRAM |
Wi-Fi |
Bluetooth |
Operating temperature |
Package (mm) |
---|---|---|---|---|---|---|---|---|---|---|---|
RTL8713ECM-VA4-CG |
400MHz |
400MHz |
500MHz |
512KB |
X |
X |
16MB |
Wi-Fi 6 (2.4GHz) |
Bluetooth 5.2 |
-20°C ~ 85°C |
QFN68 (8 x 8) |
RTL8713ECM-VA3-CG |
400MHz |
400MHz |
500MHz |
512KB |
X |
X |
8MB |
Wi-Fi 6 (2.4GHz) |
Bluetooth 5.2 |
-20°C ~ 85°C |
QFN68 (8 x 8) |
Block Diagram
Core Architecture
Real-M300 (KM4)
Armv8.1-M architecture (Arm® Cortex®-M55 ISA compatible)
Up to 400MHz, 3-stage pipeline
16KB 4-way I-Cache + 16KB 4-way D-Cache
Integrated FPU/DSP extensions, and M-profile Vector Extension (MVE)
Hardware-enforced isolation via Arm® TrustZone®-M
KR4
RISC-V RV32IMAFC architecture
400MHz single-issue in-order pipeline
16KB 4-way I-Cache + 16KB 4-way D-Cache
Open-source ISA with custom extension support
Cadence® Tensilica® HiFi 5 DSP
500MHz 5-slot VLIW architecture
8 x 32-bit MAC/cycle, Optional SP-FPU (8 SP-FMAC/cycle)
Neural Network Extension (32 x 8-bit MAC/cycle)
32KB 4-way I-Cache, 48KB 3-way D-Cache
256KB dedicated DTCM memory
Memory System
On-chip memory: 512KB SRAM
External memory (including KGD):
QSPI NOR Flash (up to 104MHz)
DQ8 DDR PSRAM (up to 250MHz)
Bus architecture: Multi-layer AXI bus with parallel access
Peripheral Interfaces
Matrix-type pin configuration, each pin supports almost all functions
Multiple communication interfaces: SPI x 2, UART x 5, I2C x 2
Hardware IR transceiver, easy to adapt to various IR protocols
Supports RTC timer and 15 independent timers
Supports 8-channel PWM timer and 1 capture timer
Supports 6-channel general-purpose 12-bit ADC
Supports 9-channel touch key
Supports 8 independent channel GDMA
Supports 1 independent watchdog, 2 secure area watchdogs, and 3 general watchdogs
Embeds a serial LEDC to control the external LED lamps
Supports thermal detector to detect and monitor the real-time temperature inside the chip
Audio system:
3-channel ADC or 4-channel digital microphone (DMIC) input
1-channel digital-to-analog converter (DAC)
Integrates 2 I2S interfaces (up to 384kHz sampling rate, supports up to 8-channel data transmission and reception)
Security
Secure boot
Arm TrustZone-M security architecture
True Random Number Generator (TRNG)
Hardware encryption engine (AES/SHA/ECDSA)
Flash full-disk/partition encryption
Read Protection (RDP) mechanism
JTAG/SWD port password protection/disabling
2KB OTP memory (2K bits available for user)
Wireless Connectivity
Wi-Fi 6 (2.4GHz 802.11ax)
Supports 802.11b/g/n/ax protocols with 20MHz bandwidth
PHY rates:286.8Mbps (HT40), 114.7Mbps (HE20)
Antenna diversity
Bluetooth 5.2 LE
LE Coded PHY long-range mode (125kbps/500kbps)
AoA/AoD positioning (±15° accuracy)
Scatternet concurrent master/slave operation
SIG Mesh v1.0 and v1.1.1
RF Performance
Wi-Fi Tx power:
11b 11Mbps: 20dBm
11g 54Mbps: 19dBm (EVM < −25dB)
11n MCS7-HT20: 18dBm (EVM < −27dB)
11ax MCS9-HE20: 16dBm (EVM < −32dB)
Wi-Fi Rx sensitivity:
11b 11Mbps: −91dBm
11g 54Mbps: −78dBm
11n MCS7-HT20: −76.5dBm
11ax MCS9-HE20: −70.5dBm
BLE specifications:
Tx power: +10dBm (0.5dB step)
Rx sensitivity: -97dBm@1Mbps
Power Management
Dynamic voltage scaling (0.8V ~ 1.2V)
Power modes:
Active mode (Wi-Fi Tx): 120mA@3.3V
Sleep mode: Peripherals and Wi-Fi can wake up the system
Deep-Sleep mode: 57.4μA (RTC retention)
Package and Reliability
QFN48 package: 6mm x 6mm
QFN68 package: 8mm x 8mm
Operating voltage:
Standard voltage: 2.97V ~ 3.63V
Operating temperature:
Standard temperature: -20°C ~ 85°C
Wide-range temperature: -40°C ~ 105°C
ESD protection: HBM ±3.5kV
Application Scenarios
Home appliance
Line controller
BLE gateway
Micro inverter
Portable energy storage
Home energy storage
Highlights
Dual-core Architecture
Real-M300 @400MHz
Armv8.1-M architecture (Arm® Cortex®-M55 ISA compatible)
Dedicated application processor
FPU/DSP extension instructions
RISC-V KR4 @400MHz
Dedicated network processor
KR4 and Real-M300 can swap roles
Storage and Security
Storage
768KB SRAM
QSPI NOR Flash
DQ8 DDR PSRAM
Security
PSA Level 1 Certified 👉
TrustZone®-M
TRNG/ECDSA
AES/SHA
JTAG/SWD password protection
Wireless
Wi-Fi6 2.4G
Wi-Fi Card Mode 👉
BLE 5.2
BLE Mesh 1.1 long Range
BT Classic
Low Power
Sleep Mode:
WoWLAN DTIM=10: 1.36mA
Wi-Fi OFF: 0.7mA
Deep-Sleep: 57.4µA
More
Audio
DMIC/PDM/I2S
Product Comparison
Package number |
Real-M300 |
KR4 |
DSP |
On-chip SRAM |
TrustZone |
Flash |
PSRAM |
Wi-Fi |
Bluetooth |
Operating temperature |
Package (mm) |
---|---|---|---|---|---|---|---|---|---|---|---|
RTL8720EAF-VA2-CG |
400MHz |
400MHz |
X |
768KB |
Y |
4MB |
X |
Wi-Fi 6 (2.4GHz) |
Bluetooth 5.2 LE |
-20°C ~ 85°C |
QFN48 (6 x 6) |
RTL8720EAF-VA3-CG |
400MHz |
400MHz |
X |
768KB |
Y |
8MB |
X |
Wi-Fi 6 (2.4GHz) |
Bluetooth 5.2 LE |
-20°C ~ 85°C |
QFN48 (6 x 6) |
RTL8720EAM-VA2-CG |
400MHz |
400MHz |
X |
768KB |
Y |
X |
4MB |
Wi-Fi 6 (2.4GHz) |
Bluetooth 5.2 LE |
-20°C ~ 85°C |
QFN48 (6 x 6) |
RTL8720EAM-VT2-CG |
400MHz |
400MHz |
X |
768KB |
Y |
X |
4MB |
Wi-Fi 6 (2.4GHz) |
Bluetooth 5.2 LE |
-40°C ~ 105°C |
QFN48 (6 x 6) |
Block Diagram
Core Architecture
Real-M300 (KM4)
Armv8.1-M architecture (Arm® Cortex®-M55 ISA compatible)
Up to 400MHz, 3-stage pipeline
16KB 4-way I-Cache + 16KB 4-way D-Cache
Integrated FPU/DSP extensions, and M-profile Vector Extension (MVE)
Hardware-enforced isolation via Arm® TrustZone®-M
KR4
RISC-V RV32IMAFC architecture
400MHz single-issue in-order pipeline
16KB 4-way I-Cache + 16KB 4-way D-Cache
Open-source ISA with custom extension support
Memory System
On-chip memory: 768KB SRAM
External memory (including KGD):
QSPI NOR Flash (up to 104MHz)
DQ8 DDR PSRAM (up to 200MHz)
Bus architecture: Multi-layer AXI bus with parallel access
Peripheral Interfaces
Matrix-type pin configuration, each pin supports almost all functions
Multiple communication interfaces: SPI x 2, UART x 5, I2C x 2
Hardware IR transceiver, easy to adapt to various IR protocols
Supports RTC timer and 15 independent timers
Supports 8-channel PWM timer and 1 capture timer
Supports 6-channel general-purpose 12-bit ADC
Supports 9-channel touch key
Supports 8 independent channel GDMA
Supports 1 independent watchdog, 2 secure area watchdogs, and 3 general watchdogs
Embeds a serial LEDC to control the external LED lamps
Supports thermal detector to detect and monitor the real-time temperature inside the chip
Security
Secure boot
Arm TrustZone-M security architecture
True Random Number Generator (TRNG)
Hardware encryption engine (AES/SHA/ECDSA)
Flash full-disk/partition encryption
Read Protection (RDP) mechanism
JTAG/SWD port password protection/disabling
2KB OTP memory (2K bits available for user)
Wireless Connectivity
Wi-Fi 6 (2.4GHz 802.11ax)
Supports 802.11b/g/n/ax protocols with 20MHz bandwidth
PHY rates:286.8Mbps (HT40), 114.7Mbps (HE20)
Antenna diversity
Bluetooth 5.2 LE
LE Coded PHY long-range mode (125kbps/500kbps)
AoA/AoD positioning (±15° accuracy)
Scatternet concurrent master/slave operation
SIG Mesh v1.0 and v1.1.1
RF Performance
Wi-Fi Tx power:
11b 11Mbps: 20dBm
11g 54Mbps: 19dBm (EVM < −25dB)
11n MCS7-HT20: 18dBm (EVM < −27dB)
11ax MCS9-HE20: 16dBm (EVM < −32dB)
Wi-Fi Rx sensitivity:
11b 11Mbps: −91dBm
11g 54Mbps: −78dBm
11n MCS7-HT20: −76.5dBm
11ax MCS9-HE20: −70.5dBm
BLE specifications:
Tx power: +10dBm (0.5dB step)
Rx sensitivity: -97dBm@1Mbps
Power Management
Dynamic voltage scaling (0.8V ~ 1.2V)
Power modes:
Active mode (Wi-Fi Tx): 120mA@3.3V
Sleep mode: Peripherals and Wi-Fi can wake up the system
Deep-Sleep mode: 57.4μA (RTC retention)
Package and Reliability
QFN48 package: 6mm x 6mm
QFN68 package: 8mm x 8mm
Operating voltage:
Standard voltage: 2.97V ~ 3.63V
Operating temperature:
Standard temperature: -20°C ~ 85°C
Wide-range temperature: -40°C ~ 105°C
ESD protection: HBM ±3.5kV
Application Scenarios
Home appliance
Line controller
BLE gateway
Micro inverter
Portable energy storage
Home energy storage
Highlights
Quad-core Architecture
Cortex-A32 Dual-core:
Dedicated application processor
Up to 1.2GHz
Linux/FreeRTOS optional
Armv8-A NEON
Real-M300:
Armv8.1-M architecture (Arm® Cortex®-M55 ISA compatible)
Dedicated Network processor
Up to 333MHz
FPU supported
DSP instructions supported
MVE supported
Real-M200:
Armv8-M architecture (Arm® Cortex®-M23 ISA compatible)
Low-power Processor
Up to 40MHz
Storage and Security
Storage
256KB SRAM
DQ16 DDR2/DDR3L
QSPI NOR/NAND Flash
DQ8 DDR PSRAM
Security
PSA Level 1 Certified 👉
TrustZone®/TrustZone®-M
TRNG
ECDSA/EdDSA/RSA
AES/SHA
JTAG/SWD password protection
Wireless
Wi-Fi6 Dual-Band
Wi-Fi Dolby Atmos Solution
Wi-Fi Card Mode 👉
BLE 5.3
BLE Mesh 1.1 Long Range
Dedicated RF and antenna for BT
LE Audio
Classic BT
Low Power
Sleep Mode:
WoWLAN DTIM=10: 435~470uA
Wi-Fi OFF: 345uA
Deep-Sleep: 23.1µA
More
display
MIPI-DSI interface
Audio
5x ADC/8x DMIC
2x DAC/headphone amplifier
2x I2S
USB 2.0: Host and Device
SD host: SD card/eMMC
Product Comparison
Package number |
CA32 |
Real-M300 |
Real-M200 |
On-chip SRAM |
TrustZone |
NOR Flash |
PSRAM |
DDR |
Wi-Fi |
Bluetooth |
GPIO |
Package (mm) |
---|---|---|---|---|---|---|---|---|---|---|---|---|
RTL8730EAH-VA3-CG |
1.2GHz |
333MHz |
40MHz |
256KB |
Y |
8MB |
8MB |
X |
Wi-Fi 6 (2.4GHz + 5GHz) |
Bluetooth 5.3 |
40 |
QFN100 (10 x 10) |
RTL8730EAH-VD3-CG |
1.2GHz |
333MHz |
40MHz |
256KB |
Y |
16MB |
8MB |
X |
Wi-Fi 6 (2.4GHz + 5GHz) |
Bluetooth 5.3 |
40 |
QFN100 (10 x 10) |
RTL8730EAH-VH6-CG |
1.2GHz |
333MHz |
40MHz |
256KB |
Y |
32MB |
X |
64MB (DDR2) |
Wi-Fi 6 (2.4GHz + 5GHz) |
Bluetooth 5.3 |
40 |
QFN100 (10 x 10) |
RTL8730EAM-VA6-CG |
1.2GHz |
333MHz |
40MHz |
256KB |
Y |
X |
X |
64MB (DDR2) |
Wi-Fi 6 (2.4GHz + 5GHz) |
Bluetooth 5.3 |
40 |
QFN100 (10 x 10) |
RTL8730ELH-VA3-CG |
1.2GHz |
333MHz |
40MHz |
256KB |
Y |
8MB |
8MB |
X |
Wi-Fi 6 (2.4GHz + 5GHz) |
Bluetooth 5.3 |
61 |
DR-QFN144 (11 x 11) |
RTL8730ELM-VA7-CG |
1.2GHz |
333MHz |
40MHz |
256KB |
Y |
X |
X |
128MB (DDR2) |
Wi-Fi 6 (2.4GHz + 5GHz) |
Bluetooth 5.3 |
61 |
DR-QFN144 (11 x 11) |
RTL8730ELM-VA8-CG |
1.2GHz |
333MHz |
40MHz |
256KB |
Y |
X |
X |
256MB (DDR3L) |
Wi-Fi 6 (2.4GHz + 5GHz) |
Bluetooth 5.3 |
61 |
DR-QFN144 (11 x 11) |
Block Diagram
Core Architecture
Dual-Core Arm® Cortex®-A32 (AP)
Armv8-A architecture (ISA)
Up to 1.2GHz, 8-stage in-order pipeline
32KB 2-way I-Cache + 32KB 4-way D-Cache
256KB 8-way L2 cache
Arm® TrustZone® security for secure/non-secure domain isolation
Real-M300 (KM4, NP)
Armv8.1-M architecture (Arm® Cortex®-M55 ISA compatible)
Up to 333MHz, 3-stage pipeline
16KB 4-way I-Cache + 32KB 4-way D-Cache
Integrated FPU/DSP/MVE extensions
Arm® TrustZone®-M hardware isolation
Real-M200 (KM0, LP)
Armv8-M architecture (Arm® Cortex®-M23 ISA compatible)
Optimized for power-critical applications
Up to 40MHz
16KB 2-way I-Cache + 8KB 2-way D-Cache
Memory System
On-chip memory: 512KB SRAM
External memory (including KGD):
QSPI NOR/NAND Flash (up to 104MHz)
DQ8 DDR PSRAM (up to 250MHz)
DQ16 DDR2/DDR3L (up to 533MHz)
Bus architecture: Multi-layer AXI bus with parallel access
Peripherals & Interfaces
Flexible design of GPIO configuration
Multi-communication interfaces: SPI x 2, UART x 4, I2C x 3
Hardware IR transceiver, easy to adapt to various IR protocols
Supports 6 channels of general 12-bit ADC and 1 channel of VBAT
Audio Codec:
5-channel ADC or 8-channel digital microphone (DMIC) input
2-channel digital-to-analog converter (DAC) and headphone amplifier
Supports 6-channel PWM timer and 1 capture timer
Supports 9-channel touch key
Supports 8 independent channel GDMA
Supports high-speed USB 2.0 OTG
Supports SD host controller to access SD card and eMMC device
Supports 1 Real-Time Clock timer together with 12 basic timers
Embeds a serial LEDC to control the external LED lamps
Supports thermal detector to detect and monitor the real-time temperature inside the chip
Supports two-lane MIPI-DSI interface with D-PHY and the maximum bit rate of 1Gbps per lane
I2S x 2: up to 384kHz sampling rate
Security
Secure boot
TrustZone®/TrustZone®-M dual-domain isolation
True Random Number Generator (TRNG)
Hardware encryption engine (AES/SHA/ECDSA/EdDSA/RSA)
Flash full-disk/partition encryption
Read Protection (RDP) mechanism
JTAG/SWD interface lock
2KB OTP memory (2K bits available for user)
Wireless Connectivity
Wi-Fi 6 (802.11ax) :
802.11 a/b/g/n/ax, 1T1R, 2.4GHz/5GHz dual-band
MCS0-MCS9 (20 MHz bandwidth)
Antenna diversity, Beamforming, Target Wake Time (TWT)
WoWLAN
Bluetooth 5.3:
BR/EDR + BLE
LE Coded PHY long-range mode (125kbps/500kbps)
LE Audio (CIS/BIS)
AoA/AoD positioning
SIG Mesh v1.0/v1.1
Scatternet support
Dedicated antenna for Bluetooth
Power Management
Fine-grained clock gating, dynamic voltage/frequency scaling (DVFS)
Power modes: Active/Sleep/Deep-Sleep (μA-level standby)
Package and Reliability
QFN100 package: 10mm x 10mm
DR-QFN144 package: 11mm x 11mm
Operating voltage:
Standard voltage: 2.97V ~ 3.63V
Operating temperature:
Wide-range temperature: -40°C ~ 105°C
ESD protection: HBM ±3.5kV
Application Scenarios
Smart speakers
Industrial gateways
Voice-controlled appliances
Smart Home
Wearables
Centralized control systems
Highlights
Dual-core Architecture
Real-M300 (KM4TZ) @334MHz
Armv8.1-M architecture (Arm® Cortex®-M55 ISA compatible)
Dedicated application processor
Real-M300 (KM4NS) @334MHz
Armv8.1-M architecture (Arm® Cortex®-M55 ISA compatible)
Dedicated network processor
Storage and Security
Storage
512KB SRAM
QSPI NOR Flash
DQ8/DQ16 DDR PSRAM
Security
Armv8.1 TrustZone®-M
TRNG
AES/SHA
ECC/RSA
JTAG/SWD password protection
Ultra-Low Power
Sleep Mode
Deep-Sleep Mode
More
Product Comparison
Part number |
Real-M300 (KM4TZ) |
Real-M300 (KM4NS) |
On-chip SRAM |
TrustZone |
Flash |
PSRAM |
Wi-Fi |
Bluetooth |
Operating voltage |
Operating temperature |
Package (mm) |
---|---|---|---|---|---|---|---|---|---|---|---|
RTL8721FAF-VA2-CG |
334MHz |
334MHz |
512KB |
Y |
4MB |
X |
Wi-Fi 6 (2.4GHz + 5GHz) |
Bluetooth 5.0 LE |
2.97V ~ 3.63V |
-20°C ~ 85°C |
QFN48 (6 x 6) |
RTL8721FAF-VT2-CG |
334MHz |
334MHz |
512KB |
Y |
4MB |
X |
Wi-Fi 6 (2.4GHz + 5GHz) |
Bluetooth 5.0 LE |
2.97V ~ 3.63V |
-40°C ~ 105°C |
QFN48 (6 x 6) |
RTL8721FAM-VA2-CG |
334MHz |
334MHz |
512KB |
Y |
X |
4MB |
Wi-Fi 6 (2.4GHz + 5GHz) |
Bluetooth 5.0 LE |
2.97V ~ 3.63V |
-20°C ~ 85°C |
QFN48 (6 x 6) |
RTL8721FAM-VT2-CG |
334MHz |
334MHz |
512KB |
Y |
X |
4MB |
Wi-Fi 6 (2.4GHz + 5GHz) |
Bluetooth 5.0 LE |
2.97V ~ 3.63V |
-40°C ~ 105°C |
QFN48 (6 x 6) |
RTL8721FCM-VA2-CG |
334MHz |
334MHz |
512KB |
Y |
X |
4MB |
Wi-Fi 6 (2.4GHz + 5GHz) |
Bluetooth 5.0 LE |
2.97V ~ 3.63V |
-20°C ~ 85°C |
QFN68 (8 x 8) |
RTL8721FCM-VA3-CG |
334MHz |
334MHz |
512KB |
Y |
X |
8MB |
Wi-Fi 6 (2.4GHz + 5GHz) |
Bluetooth 5.0 LE |
2.97V ~ 3.63V |
-20°C ~ 85°C |
QFN68 (8 x 8) |
RTL8721FLM-VA4-CG |
334MHz |
334MHz |
512KB |
Y |
X |
16MB |
Wi-Fi 6 (2.4GHz + 5GHz) |
Bluetooth 5.0 LE |
2.97V ~ 3.63V |
-20°C ~ 85°C |
QFN100 (10 x 10) |
Block Diagram
Core Architecture
Real-M300 (KM4TZ)
Armv8.1-M architecture (Arm® Cortex®-M55 ISA compatible)
Up to 334MHz, 3-stage pipeline
16KB 4-way I-Cache + 16KB 4-way D-Cache
Hardware-enforced isolation via TrustZone®-M
Real-M300 (KM4NS)
Armv8.1-M architecture (Arm® Cortex®-M55 ISA compatible)
Up to 334MHz, 3-stage pipeline
16KB 4-way I-Cache + 16KB 4-way D-Cache
Memory System
On-chip memory: 512KB SRAM
External memory (including KGD):
QSPI NOR Flash (up to 104MHz)
DQ8/DQ16 DDR PSRAM (up to 200MHz)
Bus architecture: Multi-layer AXI bus with parallel access
Peripheral Interfaces
Flexible design of GPIO configuration
Multi-communication interfaces: SPI x 2, UART x 5, I2C x 2, I2C-like x 1
Hardware IR transceiver, easy to adapt to various IR protocols
Supports Real-Time Clock timer together with 4 basic timers
Supports 4 channels of PWM timer and 1 capture timer
Supports 2 group PMC timers
Supports a general 12-bit ADC: 8 external channels and 4 internal channels
Supports 9 channels of touch pad
Supports 8 independent channels of GDMA
Supports USB 2.0 full-speed Host/Device mode
Supports SDIO Host/Device with 1-bit and 4-bit mode
Supports SD host controller to access SD card and eMMC device
Integrated Pixel Processing Engine (PPE) to process pixel data faster
LCDC
MJPEG
A2C
Ethernet MAC
Integrated audio codec supports 2 channels DMIC interface
I2S x 2: up to 384kHz sampling rate
Supports thermal detector to detect and monitor the real-time temperature inside the chip
Security Features
Secure boot
Arm TrustZone-M security architecture
True Random Number Generator (TRNG)
Hardware encryption engine (AES/SHA)
Public Key Engine(ECC/RSA)
Flash full-disk/partition encryption
Read Protection (RDP) mechanism
JTAG/SWD password protection
2KB OTP memory (2K bits available for user)
Wireless Connectivity
Wi-Fi 6 (802.11 a/b/g/n/ac/ax)
1T1R, 2.4GHz/5GHz dual-band
20MHz channel bandwidth, MCS0 ~ MCS9 modulation
Antenna diversity
WoWLAN power saving:
Bluetooth 5.0 LE
LE Coded PHY long-range mode (125kbps/500kbps)
Scatternet: 8 masters + 3 slaves
Tx Power: -10dBm ~ +10dBm (typical 8dBm)
Rx sensitivity: -99dBm@1Mbps
Power Management
Dynamic voltage/frequency scaling (2.97V ~ 3.63V)
Power modes:
Active mode: Full operation (334MHz)
Sleep mode: Peripherals or Wi-Fi can wake up the system (<100uA)
Deep-Sleep mode: 13.9µA (3.3V, 25°C)
Package and Reliability
QFN48 package: 6mm x 6mm
QFN68 package: 8mm x 8mm
QFN100 package: 10mm x 10mm
Operating voltage:
Standard voltage: 2.97V ~ 3.63V
Operating temperature:
Standard temperature: -20°C ~ 85°C
Wide-range temperature: -40°C ~ 105°C
ESD protection: HBM ±3.5kV
Smart home appliance
Line controller
Smart door lock
Battery camera
Smart remote controller
Wi-Fi speaker
Wi-Fi Card Mode
BLE gateway
Smart POS